We are seeking a Senior Engineer – High-Speed Signal Integrity to drive research in next-generation high-speed wireline electrical communication. This role is part of the High-Speed High-Frequency team within the Board Engineering department (Lab) at our Grenoble Research Center.
You will work closely with our HQ technical team in China to develop cutting-edge high-speed SerDes systems (112 Gbit/s and beyond). You will contribute to the design, simulation, and analysis of high-speed interconnects and PCBs while shaping the technology roadmap for high-speed signal integrity.
Location: Grenoble Research Center
Salary: €80,000 - €130,000 per annum (DOE)
Start Date: ASAP
About the GrenoblAbout the Rolee Research Center
Founded in 2019 by the Hardware Engineering Institute of 2012 Laboratories, our Grenoble Research Center is home to 30+ engineers, including PhDs, technical experts, and scholars from world-renowned institutions. Our young and dynamic team is dedicated to solving complex challenges in high-speed technologies for the ICT industry.
As we expand our high-speed research team, we offer a unique opportunity to work on state-of-the-art technologies with a global impact.
Duties and Responsibilities
Research and develop high-speed interconnects (passive channels) for next-gen systems 112+Gbps per lane
High-speed PCB design, simulation, and signal integrity analysis
Conduct lab verification of high-speed designs
Collaborate with the HQ team in China through technical reviews, reporting, and project planning
Define the technology roadmap and research strategy for high-speed interconnects
Requirements
? Master’s degree or PhD preferred in Electrical Engineering, Information Technology, Communication Engineering, or Electromagnetic Science
? Extensive experience in high-speed telecom/communication hardware architecture design
? Proven track record in 56Gbps+ product development and delivery
? Deep expertise in high-frequency PCB design, including impedance control and crosstalk management
? Experience in system-level simulation (PCB, connector, and cable-level analog signal simulation)
? Strong understanding of PCB/HDI stack-up design, fabrication limitations, and cost factors
? Knowledge of high-speed SerDes architectures (Rx/Tx SerDes PHY, equalization techniques, CDR, DSP challenges)
Preferred Skills
? Familiarity with high-speed serial hardware (SerDes, ASIC, DSP, PCB, connectors)
? Hands-on expertise in high-speed lab experiments (real-time oscilloscopes, VNAs) and simulation correlation
? Knowledge of industry standards (IEEE 802.3, OIF-CEI, InfiniBand, CEI-224G)
? Active participation in conferences and industry events
? Passion for technology and innovation, with a strong drive to contribute to high-speed signal integrity research
Technical Tools & Work
High-Speed / High-Frequency Design & Simulation: CST, ANSYS HFSS
SI Analysis: ADS, Sigrity, MATLAB, Python
SerDes Modeling & Simulation: Python (preferred), MATLAB, Verilog-A, ADS
Benefits
Work on cutting-edge 112 Gbit/s+ SerDes systems
Collaborate with a global R&D team
Engage in high-impact research with industry experts
Shape the future of high-speed signal integrity
Apply now to be part of a world-class research team in high-speed communication!
How to Apply
Please submit your resume and a cover letter detailing your experience and suitability for the role. We look forward to exploring how you can contribute to our team’s innovative projects in high-speed interconnection and board-level process reliability.
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